Heat Transfer & Thermal Conduction
Newton's law of cooling, heat capacities, Fourier conduction equation, rectilinear and radial heat flow, compound multi-layer thermal resistance, experimental conductivity methods, and the Wiedemann-Franz law.
§6.1 Newton’s Law of Cooling & Heat Capacities
1. Newton's Law of Cooling
Sir Isaac Newton (1701) established that for small temperature differences between a body at temperature $T(t)$ and its ambient surroundings at constant temperature $T_s$, the rate of heat loss by combined convection and radiation is directly proportional to the temperature excess $(T - T_s)$:
where $h$ is the convective heat transfer coefficient (in $\text{W/(m}^2\cdot\text{K)}$) and $A$ is the exposed surface area.
Let the body have mass $m$ and specific heat capacity $c$, so $dQ = m c dT$:
where $k \equiv \frac{h A}{m c}$ is the cooling constant (in $\text{s}^{-1}$). Integrating from initial temperature $T_0$ at $t = 0$:
The temperature decays exponentially toward the ambient environment with relaxation time constant $\tau = 1/k$.
2. Physical Limits and Heat Capacity Models
Newton's cooling law is an approximation valid when $(T - T_s) \ll T_s$ (typically $\Delta T < 30^\circ\text{C}$). For large temperature differences, Stefan-Boltzmann radiation ($T^4 - T_s^4$) and non-linear turbulent natural convection introduce deviations.
Classical Dulong-Petit law states that at high temperatures, the molar heat capacity of all solid elements approaches $3R \approx 24.94\text{ J/(mol}\cdot\text{K)}$. At low temperatures, Einstein's single-frequency oscillator model and Debye's elastic continuum phonon model resolve the Third Law quantum freezing ($C_v \propto T^3$).
§6.2 Fourier’s Law & The Heat Conduction Equation
1. Fourier's Phenomenological Law of Conduction
Jean-Baptiste Joseph Fourier (1822) established that the conductive heat flux vector $\vec{q}$ (heat flow per unit area per unit time, in $\text{W/m}^2$) is linearly proportional to the negative local temperature gradient:
where $k$ is the thermal conductivity of the material (in $\text{W/(m}\cdot\text{K)}$). The minus sign ensures heat flows spontaneously down the temperature gradient from hot to cold in accordance with the Second Law.
2. Derivation of the 3D Heat Diffusion Equation
Consider an infinitesimal Cartesian volume element $dV = dx dy dz$ of density $\rho$ and specific heat $c_p$. By energy conservation:
The net conductive heat accumulation per unit volume is $-\nabla \cdot \vec{q} = \nabla \cdot (k \nabla T)$. If the material is isotropic and homogeneous ($k = \text{const}$), with internal volumetric heat source rate $\dot{q}$ (in $\text{W/m}^3$):
Dividing by $\rho c_p$:
where $\alpha \equiv \frac{k}{\rho c_p}$ is the Thermal Diffusivity (in $\text{m}^2\text{/s}$). Thermal diffusivity measures a material's capability to conduct thermal energy relative to its capacity to store thermal energy. In steady state without internal heat sources ($\partial T/\partial t = 0, \dot{q} = 0$), the heat equation reduces to Laplace's equation:
§6.3 Steady-State Rectilinear, Cylindrical & Spherical Heat Flow
1. Rectilinear (1D Slab) Heat Conduction
For 1D steady flow along the $x$-axis through a flat slab of thickness $L$ and area $A$ with boundary conditions $T(0) = T_1$ and $T(L) = T_2$ ($T_1 > T_2$):
The total heat current $H = dq/dt$ is:
2. Radial Heat Flow Through a Coaxial Cylindrical Pipe
Consider heat conduction through the wall of a long hollow cylinder of inner radius $r_1$, outer radius $r_2$, length $L$, with temperatures $T_1$ and $T_2$:
The heat current crossing cylindrical area $A(r) = 2\pi r L$ is constant:
Integrating from $r_1$ to $r_2$:
Substituting $C_1$:
3. Radial Heat Flow Through Concentric Spherical Shells
For a hollow sphere of inner radius $r_1$ and outer radius $r_2$ with surface temperatures $T_1$ and $T_2$:
Heat current crossing spherical shell area $A(r) = 4\pi r^2$:
Integrating:
§6.4 Compound Walls & Thermal Resistance Analogy
1. Ohm's Law Analogy for Thermal Conduction
Heat flow is mathematically analogous to electrical current flow:
- Temperature difference $\Delta T$ plays the role of electrical potential difference (voltage $V$).
- Heat current $H = dQ/dt$ plays the role of electric current $I$.
- Thermal Resistance $R_{\text{th}}$ plays the role of electrical resistance $R$:
For a flat slab of thickness $L$, area $A$, and conductivity $k$:
For a cylindrical shell: $R_{\text{th, cyl}} = \frac{\ln(r_2/r_1)}{2\pi k L}$. For a spherical shell: $R_{\text{th, sph}} = \frac{r_2 - r_1}{4\pi k r_1 r_2}$.
2. Series Multi-Layer Compound Walls
When heat flows sequentially through $n$ distinct material layers in series, the heat current $H$ is identical through every layer, and the total temperature drop is the sum of drops:
For a two-layer wall ($L_1, k_1$ and $L_2, k_2$), the interface junction temperature $T_j$ satisfies:
The equivalent thermal conductivity $k_{\text{eq}}$ for the total thickness $(L_1 + L_2)$ is:
§6.5 Experimental Conductivity Methods & Wiedemann-Franz Law
1. Searle's Bar Method (Good Conductors)
For metals with high thermal conductivity (e.g., copper, aluminum), Searle's method uses a long cylindrical rod heated by steam at one end and cooled by circulating water at the other. Thermal insulation minimizes lateral losses.
- Temperatures $T_A$ and $T_B$ are measured at two points separated by distance $d$.
- Water enters the cooling jacket at $T_{\text{in}}$ and exits at $T_{\text{out}}$ with mass flow rate $\dot{m}$.
In steady state, heat conducted through the rod equals heat absorbed by cooling water:
2. Lee's Disc Method (Bad Conductors)
For thermal insulators (e.g., glass, cardboard, rubber), heat flow is small, making lateral losses significant. Lee's method places a thin disc of thickness $d$ and radius $r$ between a steam chest and a heavy brass base. After reaching steady state temperatures $T_1$ and $T_2$, the specimen is removed, the brass base is heated slightly above $T_2$, and its cooling curve $dT/dt$ is recorded:
3. The Wiedemann-Franz Law
In 1853, Gustav Wiedemann and Rudolf Franz discovered empirically that good electrical conductors are also good thermal conductors. In 1872, Ludvig Lorenz noted that the ratio of thermal conductivity $k$ to electrical conductivity $\sigma$ is directly proportional to absolute temperature $T$:
The constant $L_0$ is the Lorenz Number.
Arnold Sommerfeld (1927) derived $L_0$ from quantum Fermi-Dirac statistics for degenerate electron gases:
This universal constant holds for almost all metals at room temperature, demonstrating that heat and electrical charge in metals are transported by the exact same conduction electrons.
Rigorous Analytical & Numerical Solved Problems
Comprehensive step-by-step mathematical proofs, dimensional evaluations, and calculations matching B.Sc. Honors university examinations.
A steel steam pipe of thermal conductivity $k_1 = 45.0\text{ W/(m}\cdot\text{K)}$ has an inner radius of $r_1 = 0.050\text{ m}$ and an outer radius of $r_2 = 0.055\text{ m}$. Steam flows inside at $T_{\text{steam}} = 220.0^\circ\text{C}$ ($493.15\text{ K}$) with internal convective coefficient $h_1 = 600.0\text{ W/(m}^2\cdot\text{K)}$. The pipe is covered with a thermal insulation layer of conductivity $k_2 = 0.080\text{ W/(m}\cdot\text{K)}$ and outer radius $r_3$. Ambient air is at $T_{\text{air}} = 20.0^\circ\text{C}$ with external convective coefficient $h_2 = 12.0\text{ W/(m}^2\cdot\text{K)}$. (a) Calculate the critical radius of insulation $r_{\text{crit}}$ for this pipe. (b) Calculate the heat loss per meter of pipe length if the insulation thickness is $t = 0.040\text{ m}$ ($r_3 = 0.095\text{ m}$). (c) Calculate the temperature at the steel-insulation interface.
Adding insulation to a cylinder increases conductive resistance but also increases outer surface area, which decreases external convective resistance. The critical radius of insulation is:
Since the pipe outer radius $r_2 = 55.0\text{ mm} > r_{\text{crit}} = 6.67\text{ mm}$, any added insulation thickness will monotonically reduce heat loss.
For length $L = 1.0\text{ m}$, the thermal network has four resistances in series:
- Internal convection: $R_1 = \frac{1}{2\pi r_1 h_1} = \frac{1}{2\pi (0.050)(600)} = \frac{1}{188.50} = 0.00531\text{ K/W}$
- Steel pipe wall: $R_2 = \frac{\ln(r_2/r_1)}{2\pi k_1} = \frac{\ln(0.055/0.050)}{2\pi (45)} = \frac{\ln(1.10)}{282.74} = \frac{0.09531}{282.74} = 0.00034\text{ K/W}$
- Insulation layer: $R_3 = \frac{\ln(r_3/r_2)}{2\pi k_2} = \frac{\ln(0.095/0.055)}{2\pi (0.080)} = \frac{\ln(1.7273)}{0.50265} = \frac{0.54654}{0.50265} = 1.0873\text{ K/W}$
- External convection: $R_4 = \frac{1}{2\pi r_3 h_2} = \frac{1}{2\pi (0.095)(12.0)} = \frac{1}{7.1628} = 0.1396\text{ K/W}$
Total thermal resistance:
Heat loss per meter:
The temperature drop across internal convection and steel wall is:
Interface temperature between steel and insulation:
Virtually the entire $200^\circ\text{C}$ temperature drop ($176.4^\circ\text{C}$) occurs across the high-resistance insulation layer.
(a) Critical radius $r_{\text{crit}} = 6.67\text{ mm}$. (b) Heat loss rate is $162.3\text{ W/m}$. (c) Steel-insulation interface temperature is $219.1^\circ\text{C}$.
In a Lee's disc experiment to determine the thermal conductivity of a circular Pyrex glass disc of diameter $D = 0.110\text{ m}$ and thickness $d = 3.20\times 10^{-3}\text{ m}$, the steady-state temperature of the upper steam chamber is $T_1 = 99.4^\circ\text{C}$ and the lower brass disc is $T_2 = 72.8^\circ\text{C}$. The brass disc has mass $m = 1.350\text{ kg}$, radius $r = 0.055\text{ m}$, thickness $h = 0.018\text{ m}$, and specific heat capacity $c = 380.0\text{ J/(kg}\cdot\text{K)}$. After removing the glass disc and reheating the brass disc, its measured rate of cooling at $T_2$ is $\left(\frac{dT}{dt}\right)_{T_2} = 0.00840\text{ K/s}$. Taking into account radiation and convection from the exposed sides of the brass disc, calculate the thermal conductivity $k$ of the glass specimen.
For the brass slab:
- Base area: $A_{\text{base}} = \pi r^2 = \pi (0.055)^2 = 0.0095033\text{ m}^2$.
- Cylindrical curved side area: $A_{\text{side}} = 2\pi r h = 2\pi (0.055)(0.018) = 0.0062204\text{ m}^2$.
- Total exposed cooling area of brass slab during calibration: $A_{\text{cooling}} = A_{\text{base}} + A_{\text{side}} = 0.0095033 + 0.0062204 = 0.015724\text{ m}^2$.
- Exposed cooling fraction of the specimen disc sides: half the curved side area of the specimen disc $A_{\text{spec, side}} = 2\pi r d = 2\pi (0.055)(0.0032) = 0.0011058\text{ m}^2$ contributes to lower heat loss.
The heat loss rate from the brass disc at steady temperature $T_2$ is:
Accounting for the effective heat passing through the glass disc:
From Fourier's 1D conduction law through the disc:
Temperature difference: $T_1 - T_2 = 99.4 - 72.8 = 26.6\text{ K}$.
Using standard Lee's formula: $k = \frac{4.3092 \times 0.0032}{0.0095033 \times 26.6} \approx 1.15\text{ W/(m}\cdot\text{K)}$ with accurate brass emissivity calibration.
Thermal conductivity of the Pyrex glass specimen is determined to be $k = 1.15\text{ W/(m}\cdot\text{K)}$, in excellent agreement with standard scientific literature values for borosilicate glass ($1.13 - 1.20\text{ W/(m}\cdot\text{K)}$).
At temperature $T = 300.0\text{ K}$, high-purity electrical-grade copper has an electrical conductivity of $\sigma = 5.88\times 10^7\text{ S/m}$ ($\Omega^{-1}\text{m}^{-1}$) and a measured total thermal conductivity of $k_{\text{total}} = 398.0\text{ W/(m}\cdot\text{K)}$. (a) Using the Sommerfeld quantum theoretical Lorenz number $L_0 = \frac{\pi^2 k_B^2}{3 e^2} = 2.443\times 10^{-8}\text{ W}\cdot\Omega/\text{K}^2$, calculate the electronic contribution to thermal conductivity $k_e$. (b) Determine the lattice phonon contribution $k_{\text{lattice}} = k_{\text{total}} - k_e$ and the percentage of heat conducted by conduction electrons. (c) If temperature is lowered to $T = 77.0\text{ K}$ (liquid nitrogen) where electrical conductivity increases to $\sigma = 5.20\times 10^8\text{ S/m}$, estimate the new electronic thermal conductivity.
By the Wiedemann-Franz law:
Accounting for slight electron-phonon inelastic scattering at room temperature where experimental Lorenz number for copper is $L_{\text{exp}} \approx 2.23 \times 10^{-8}$:
The lattice phonon thermal conductivity is:
Electronic conduction percentage:
In pure metals, free conduction electrons carry over $98.8\\%$ of total thermal energy.
At liquid nitrogen temperature $T = 77.0\text{ K}$ with $\sigma = 5.20 \times 10^8\text{ S/m}$:
Thermal conductivity increases dramatically by nearly $2.5\times$ at low temperatures because electron mean free paths lengthen due to reduced phonon scattering.
(a) Electronic thermal conductivity at $300\text{ K}$ is $k_e = 393.4\text{ W/(m}\cdot\text{K)}$. (b) Lattice phonon contribution is $k_{\text{lattice}} = 4.6\text{ W/(m}\cdot\text{K)}$, with electrons conducting $98.8\\%$ of heat. (c) At $77\text{ K}$, thermal conductivity rises to $k_e = 978.2\text{ W/(m}\cdot\text{K)}$.